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Handbook of Micromechanics and Nanomechanics




ISBN 9789814411233
Published April 8, 2013 by Jenny Stanford Publishing
1264 Pages - 66 Color & 330 B/W Illustrations

 
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Book Description

This book presents the latest developments and applications of micromechanics and nanomechanics. It particularly focuses on some recent applications and impact areas of micromechanics and nanomechanics that have not been discussed in traditional micromechanics and nanomechanics books on metamaterials, micromechanics of ferroelectric/piezoelectric, electromagnetic materials, micromechanics of interface, size effects and strain gradient theories, computational and experimental nanomechanics, multiscale simulations and theories, soft matter composites, and computational homogenization theory. This book covers analytical, experimental, as well as computational and numerical approaches in depth.

Table of Contents

Preface S. Li and X.-L. Gao
Microdynamics of Phononic Materials
M. I. Hussein, M. J. Frazier, and M. H. Abedinnasab
Micromechanics of Elastic Metamaterials
X. Zhou, X. Liu, and G. Hu
Phase Field Approach Micromechanics in Ferroelectric Crystals
Y. Su and G. J. Weng
Atomic Structure of 180° Ferroelectric Domain Walls in PbTiO3
A. Yavari and A. Angoshtari
Micromechanics-based Constitutive Modeling of Chain-Structured Ferromagnetic Particulate Composites
H. Yin, L. Z. Sun, and H. Zhang
Nonlinear Dynamic Electromechanics in Functionally Graded Piezoelectric Materials
Y. Shindo and F. Narita
Mechano-electrochemical Mixture Theories for the Multiphase Fluid–Infiltrated Poroelastic Media
H. Hatami-Marbini
Micromechanics of Nanocomposites with Interface Energy Effects
Z. Huang and J. Wang
A Surface/Interface Micro-elasticity Formulation Based on Finite-Size Representative Volume Element
P.-A. Itty, V. L. Corvec, and S. Li
Continuum-Based Modeling of Size Effects in Micro- and Nanostructured Materials
R. K. Abu Al-Rub
Strain Gradient Solutions of Eshelby-Type Inclusion Problems
X.-L. Gao
Problems in the Theories of Couple-Stress Elasticity and Dipolar Gradient Elasticity: A Comparison
P. A. Gourgiotis and H. G. Georgiadis
Solutions to the Periodic Eshelby Inclusion Problem
L. Liu
Variational Principles, Bounds, and Percolation Thresholds of Composites
X. F. Xu
Inclusion Clusters in the Archetype-Blending Continuum Theory
K. I. Elkhodary, S. Tang, and W. K. Liu
Microstructural Characterization of Metals Using Nanoindentation
G. Z. Voyiadjis and D. Faghihi
A Multiscale Modeling of Multiple Physics
X. Wang, J. Li, J. D. Lee, and A. Eskandarian
Coarse-Grained Atomistic Simulations of Dislocation and Fracture in Metallic Materials
L. Xiong., Q. Deng, and Y. Chen
Timescaling in Multiscale Mechanics of Nanowires and Nanocrystalline Materials
V. Tomar
Modeling and Simulation of Carbon Nanotube–Based Composites and Devices
S. Xiao, J. Ni, W. Yang, and C. Nelsen
Concurrent Approach to Lattice Dynamics Based on Extended Space–Time Finite Element Method D. Qian and S. Chirputkar
Mechanics of Nanoporous Metals
A. Giri, J. Tao, M. Kirca, and A. C. To
Numerical Characterization of Nanowires
Y. T. Gu and H. F. Zhan
Molecular Modeling of the Microstructure of Soft Materials: Healing, Memory, and Toughness Mechanisms
S. Keten, S. Mishra, and L. Ruiz
Intricate Multiscale Mechanical Behavior of Natural Fish-Scale Composites
D. Zhu, F. Barthelat, and F. Vernerey
Mechanics of Random Fiber Networks R. C. Picu
Size-Dependent Probabilistic Damage Micromechanics and Toughening Behavior of Particle-/Fiber-Reinforced Composites
J. Woody and K. Yanase
Multiscale Asymptotic Expansion Formulations for Heterogeneous Slab and Column Structures with Three-Dimensional Microstructures
D. Wang, L. Fang, and P. Xie
Computational Overlap Coupling Between Micropolar Elastic Continuum Finite Elements and Elastic Spherical Discrete Elements in One Dimension
R. A. Regueiro and B. Yan
Nonconcurrent Computational Homogenization of Nonlinear, Stochastic, and Viscoelastic Materials
J. Yvonnet, Q.-C. He, E. Monteiro, A. B. Tran, C. Toulemonde, J. Sanahuja, A. Clément, and C. Soize

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Reviews

"This book represents an extensive collection of state-of-the-art studies on micromechanics and nanomechanics. It is a very comprehensive text covering a wide range of theories and numerical and experimental methods, and it has applications to many important classes of materials and structures. It is an excellent reference for scientists, engineers, and students."
—Prof. Yonggang Huang, Northwestern University, USA

"This is an impressive and unique collection of review articles on a wide range of cutting-edge topics in micromechanics and nanomechanics of novel materials. I found the depth in the mechanics remarkable, extending to such topics as solutions to the periodic Eshelby inclusion problem. Overall, there is a balance of theory and applications, and it will be most useful for researchers and developers of new technologies."
—Prof. Xanthippi Markenscoff, University of California, San Diego, USA

"Micromechanics and nanomechanics are major fields that link mechanics, materials science, physics, and chemistry and have been at the forefront in the development of advanced materials. This handbook, written by leaders in their various fields, presents snapshots of recent advances in the fields of micromechanics and nanomechanics through 30 well-written chapters. It is very suitable for beginning and advanced researchers and for readers just wishing to become up to date on some new and interesting topics: For the beginner the chapters are clear enough to understand advanced topics and ample references are provided for further study; the advanced researcher wishing to be updated on a possibly unfamiliar topic will find that the chapters provide a good start and give sources for further research. The scope of the handbook leads to techniques that are appropriate to various length scales, ranging from the atomistic to the continuum, and the notations used appear to be standard. Overall the handbook represents a valuable contribution to the literature of micromechanics and nanomechanics. This reviewer is impressed by the scope of the materials presented and the careful writing that covers these advanced topics."
—Prof. Leon M. Keer, Northwestern University, USA