Jenny Stanford Publishing
412 pages | 43 Color Illus. | 241 B/W Illus.
Microelectromechanical systems (MEMS)-based sensors and actuators have become remarkably popular in the past few decades. Rapid advances have taken place in terms of both technologies and techniques of fabrication of MEMS structures. Wet chemical–based silicon bulk micromachining continues to be a widely used technique for the fabrication of microstructures used in MEMS devices. Researchers all over the world have contributed significantly to the advancement of wet chemical–based micromachining, from understanding the etching mechanism to exploring its application to the fabrication of simple to complex MEMS structures. In addition to its various benefits, one of the unique features of wet chemical–based bulk micromachining is the ability to fabricate slanted sidewalls, such as 45° walls as micromirrors, as well as freestanding structures, such as cantilevers and diaphragms. This makes wet bulk micromachining necessary for the fabrication of structures for myriad applications.
This book provides a comprehensive understating of wet bulk micromachining for the fabrication of simple to advanced microstructures for various applications in MEMS. It includes introductory to advanced concepts and covers research on basic and advanced topics on wet chemical–based silicon bulk micromachining. The book thus serves as an introductory textbook for undergraduate- and graduate-level students of physics, chemistry, electrical and electronic engineering, materials science, and engineering, as well as a comprehensive reference for researchers working or aspiring to work in the area of MEMS and for engineers working in microfabrication technology.
A Brief Introduction of the Crystal Structure
Unit Cell: Primitive and Nonprimitive
Types of Lattices
Index System for Crystal Planes and Directions
Brief Overview of Silicon Wafer Manufacturing and Microfabrication Techniques
What Is Silicon?
Why Is Silicon Used as a Material for ICs and MEMS?
What Are Microelectromechanical Systems?
Silicon Microfabrication Processes
Isotropic Etching of Silicon and Related Materials
Isotropic Etching Properties
Isotropic Etching Solutions
Conditions for Isotropic Etching
KOH-Based Anisotropic Etching
Etching in Pure KOH Solutions
Effect of Alcohols and Surfactant Additives
TMAH-Based Anisotropic Etching
The Etching Mechanism
Undercutting and Etched Profiles
Why Are Etching Characteristics Affected When a Surfactant Is Added to TMAH?
Etched Profile Control
Convex and Concave Corners in Silicon Wet Bulk Micromachining
Etch Rate, Underetching, and Undercutting
Role of Corner Undercutting in MEMS Fabrication
Why Does Undercutting Start at Convex Corners?
Etched Profiles at Sidewalls and Corners
Fabrication Techniques of Convex Corners
Alignment of Mask Patterns to Crystallographic Directions
Role of Precise Alignment in Wet Bulk Micromachining
Simple to Complex Structures Using Wet Bulk Micromachining
Cavities, Channels, and Mesa Structures
Microstructures with 45° Slanted Sidewalls
Microstructures with Perfectly Sharp Edges and Corners
Suspended Microfluidic Channels
Microvalves and Micropumps
Microstructures Inside a Silicon Wafer
Dry-Assisted Wet Etching
Silicon Molds for the Fabrication of PDMS Structures
Complex Patterns for Very-High-Aspect-Ratio Microstructures Using Photoelectrochemical