1st Edition

Surface Impedance Boundary Conditions A Comprehensive Approach

By Sergey V. Yuferev, Nathan Ida Copyright 2010
    412 Pages 130 B/W Illustrations
    by CRC Press

    Surface Impedance Boundary Conditions is perhaps the first effort to formalize the concept of SIBC or to extend it to higher orders by providing a comprehensive, consistent, and thorough approach to the subject.
    The product of nearly 12 years of research on surface impedance, this book takes the mystery out of the largely overlooked SIBC. It provides an understanding that will help practitioners select, use, and develop these efficient modeling tools for their own applications. Use of SIBC has often been viewed as an esoteric issue, and they have been applied in a very limited way, incorporated in computation as an ad hoc means of simplifying the treatment for specific problems.

    Apply a Surface Impedance "Toolbox" to Develop SIBCs for Any Application

    The book not only outlines the need for SIBC but also offers a simple, systematic method for constructing SIBC of any order based on a perturbation approach. The formulation of the SIBC within common numerical techniques—such as the boundary integral equations method, the finite element method, and the finite difference method—is discussed in detail and elucidated with specific examples.
    Since SIBC are often shunned because their implementation usually requires extensive modification of existing software, the authors have mitigated this problem by developing SIBCs, which can be incorporated within existing software without system modification.

    The authors also present:

    • Conditions of applicability, and errors to be expected from SIBC inclusion
    • Analysis of theoretical arguments and mathematical relationships
    • Well-known numerical techniques and formulations of SIBC
    • A practical set of guidelines for evaluating SIBC feasibility and maximum errors their use will produce

    A careful mix of theory and practical aspects, this is an excellent tool to help anyone acquire a solid grasp of SIBC and maximize their implementation potential.

    Classical Surface Impedance Boundary Conditions
    Skin Effect Approximation
    SIBCs of the Order of Leontovich’s Approximation
    High-Order SIBCs
    Rytov’s Approach

    General Perturbation Approach to Derivation of Surface
    Impedance Boundary Conditions
    Local Coordinates
    Perturbation Technique
    Tangential Components
    Normal Components
    Normal Derivatives
    Components of the Curl Operator
    Surface Impedance ‘‘Toolbox’’ Concept
    Numerical Example

    SIBCs in Terms of Various Formalisms
    Basic Equations
    Electric Field–Magnetic Field Formalism
    Magnetic Scalar Potential Formalism
    Magnetic Vector Potential Formalism
    Common Representation of Various SIBCs Using a Surface Impedance Function
    Surface Impedance near Corners and Edges

    Calculation of the Electromagnetic Field Characteristics in the Conductor’s Skin Layer
    Distributions across the Skin Layer
    Resistance and Internal Inductance
    Forces Acting on the Conductor

    Derivation of SIBCs for Nonlinear and Nonhomogeneous Problems
    Coupled Electromagnetic-Thermal Problems
    Magnetic Materials
    Nonhomogeneous Conductors

    Implementation of SIBCs for the Boundary Integral Equation Method: Low-Frequency Problems
    Two-Dimensional Problems
    Three-Dimensional Problems
    Properties of the Surface Impedance Function
    Boundary Element Formulations for Two- and Three-Dimensional Problems in Invariant Form
    Numerical Examples
    Quasi-Three-Dimensional Integro-Differential Formulation for Symmetric Systems of Conductors

    Implementation of SIBCs for the Boundary Integral Equation Method: High-Frequency Problems
    Integral Representations of High-Frequency Electromagnetic Fields
    SIBCs for Lossy Dielectrics
    Direct Implementation of SIBCs into the Surface Integral Equations
    Implementation Using the Perturbation Technique
    Numerical Example

    Implementation of SIBCs for Volume Discretization Methods
    Statement of the Problem
    Finite-Difference Time-Domain Method
    Finite Integration Technique
    Finite-Element Method

    Application and Experimental Validation of the SIBC Concept
    Selection of the Surface Impedance Boundary Conditions for a Given Problem
    Experimental Validation of SIBCs

    Appendix A: Review of Numerical Methods



    Sergey Yuferev was born in St. Petersburg, Russia, in 1964. He received his MSc in computational fluid mechanics from St. Petersburg Technical University, St. Petersburg, in 1987, and his Ph.D. in computational electromagnetic from the A.F. Ioffe Institute, St. Petersburg, in 1992. From 1987 to 1998, he worked at with the Dense Plasma Dynamics Laboratory, A.F. Ioffe Institute. From 1999 to 2000, he was a visiting associate professor at the University of Akron, Akron, Ohio. Since 2000, he has been with the Nokia Corporation, Tampere, Finland. His current research interests include numerical and analytical methods of computational electromagnetics and their application to electromagnetic compatibility and electromagnetic interference problems of mobile phones.

    Nathan Ida is currently a distinguished professor of electrical and computer engineering at the University of Akron, Akron, Ohio. He teaches electromagnetics, antenna theory, electromagnetic compatibility, sensing and actuation, and computational methods and algorithms. His current research interests include numerical modeling of electromagnetic fields, electromagnetic wave propagation, theoretical issues in computation, and nondestructive testing of materials at low and microwave frequencies as well as in communications, especially, in low-power remote control and wireless sensing. He has published extensively on electromagnetic field computation, parallel and vector algorithms and computation, nondestructive testing of materials, surface impedance boundary conditions, and other topics. He is the author of three books and co-author of a fourth. Dr. Ida is a fellow of the IEEE and the American Society of Nondestructive Testing.