Surface Impedance Boundary Conditions: A Comprehensive Approach, 1st Edition (Hardback) book cover

Surface Impedance Boundary Conditions

A Comprehensive Approach, 1st Edition

By Sergey V. Yuferev, Nathan Ida

CRC Press

412 pages | 130 B/W Illus.

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pub: 2009-09-28
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Surface Impedance Boundary Conditions is perhaps the first effort to formalize the concept of SIBC or to extend it to higher orders by providing a comprehensive, consistent, and thorough approach to the subject.

The product of nearly 12 years of research on surface impedance, this book takes the mystery out of the largely overlooked SIBC. It provides an understanding that will help practitioners select, use, and develop these efficient modeling tools for their own applications. Use of SIBC has often been viewed as an esoteric issue, and they have been applied in a very limited way, incorporated in computation as an ad hoc means of simplifying the treatment for specific problems.

Apply a Surface Impedance "Toolbox" to Develop SIBCs for Any Application

The book not only outlines the need for SIBC but also offers a simple, systematic method for constructing SIBC of any order based on a perturbation approach. The formulation of the SIBC within common numerical techniques—such as the boundary integral equations method, the finite element method, and the finite difference method—is discussed in detail and elucidated with specific examples.

Since SIBC are often shunned because their implementation usually requires extensive modification of existing software, the authors have mitigated this problem by developing SIBCs, which can be incorporated within existing software without system modification.

The authors also present:

  • Conditions of applicability, and errors to be expected from SIBC inclusion
  • Analysis of theoretical arguments and mathematical relationships
  • Well-known numerical techniques and formulations of SIBC
  • A practical set of guidelines for evaluating SIBC feasibility and maximum errors their use will produce

A careful mix of theory and practical aspects, this is an excellent tool to help anyone acquire a solid grasp of SIBC and maximize their implementation potential.

Table of Contents

Classical Surface Impedance Boundary Conditions

Skin Effect Approximation

SIBCs of the Order of Leontovich’s Approximation

High-Order SIBCs

Rytov’s Approach


General Perturbation Approach to Derivation of Surface

Impedance Boundary Conditions

Local Coordinates

Perturbation Technique

Tangential Components

Normal Components

Normal Derivatives

Components of the Curl Operator

Surface Impedance ‘‘Toolbox’’ Concept

Numerical Example


SIBCs in Terms of Various Formalisms

Basic Equations

Electric Field–Magnetic Field Formalism

Magnetic Scalar Potential Formalism

Magnetic Vector Potential Formalism

Common Representation of Various SIBCs Using a Surface Impedance Function

Surface Impedance near Corners and Edges

Calculation of the Electromagnetic Field Characteristics in the Conductor’s Skin Layer

Distributions across the Skin Layer

Resistance and Internal Inductance

Forces Acting on the Conductor

Derivation of SIBCs for Nonlinear and Nonhomogeneous Problems

Coupled Electromagnetic-Thermal Problems

Magnetic Materials

Nonhomogeneous Conductors

Implementation of SIBCs for the Boundary Integral Equation Method: Low-Frequency Problems

Two-Dimensional Problems

Three-Dimensional Problems

Properties of the Surface Impedance Function

Boundary Element Formulations for Two- and Three-Dimensional Problems in Invariant Form

Numerical Examples

Quasi-Three-Dimensional Integro-Differential Formulation for Symmetric Systems of Conductors

Implementation of SIBCs for the Boundary Integral Equation Method: High-Frequency Problems

Integral Representations of High-Frequency Electromagnetic Fields

SIBCs for Lossy Dielectrics

Direct Implementation of SIBCs into the Surface Integral Equations

Implementation Using the Perturbation Technique

Numerical Example


Implementation of SIBCs for Volume Discretization Methods

Statement of the Problem

Finite-Difference Time-Domain Method

Finite Integration Technique

Finite-Element Method


Application and Experimental Validation of the SIBC Concept

Selection of the Surface Impedance Boundary Conditions for a Given Problem

Experimental Validation of SIBCs

Appendix A: Review of Numerical Methods


About the Authors

Sergey Yuferev was born in St. Petersburg, Russia, in 1964. He received his MSc in computational fluid mechanics from St. Petersburg Technical University, St. Petersburg, in 1987, and his Ph.D. in computational electromagnetic from the A.F. Ioffe Institute, St. Petersburg, in 1992. From 1987 to 1998, he worked at with the Dense Plasma Dynamics Laboratory, A.F. Ioffe Institute. From 1999 to 2000, he was a visiting associate professor at the University of Akron, Akron, Ohio. Since 2000, he has been with the Nokia Corporation, Tampere, Finland. His current research interests include numerical and analytical methods of computational electromagnetics and their application to electromagnetic compatibility and electromagnetic interference problems of mobile phones.

Nathan Ida is currently a distinguished professor of electrical and computer engineering at the University of Akron, Akron, Ohio. He teaches electromagnetics, antenna theory, electromagnetic compatibility, sensing and actuation, and computational methods and algorithms. His current research interests include numerical modeling of electromagnetic fields, electromagnetic wave propagation, theoretical issues in computation, and nondestructive testing of materials at low and microwave frequencies as well as in communications, especially, in low-power remote control and wireless sensing. He has published extensively on electromagnetic field computation, parallel and vector algorithms and computation, nondestructive testing of materials, surface impedance boundary conditions, and other topics. He is the author of three books and co-author of a fourth. Dr. Ida is a fellow of the IEEE and the American Society of Nondestructive Testing.

Subject Categories

BISAC Subject Codes/Headings:
TECHNOLOGY & ENGINEERING / Telecommunications