Advanced Materials Characterization : Basic Principles, Novel Applications, and Future Directions book cover
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Advanced Materials Characterization
Basic Principles, Novel Applications, and Future Directions



  • Available for pre-order on April 13, 2023. Item will ship after May 4, 2023
ISBN 9781032375106
May 4, 2023 Forthcoming by CRC Press
191 Pages 57 B/W Illustrations

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Book Description

The book covers various methods of characterization of advanced materials commonly used in engineering including understanding of the working principle and applicability of devices. It explores the techniques implemented for advanced materials like superalloys, thin films, powders, nanocomposites, polymers, shape memory alloys, high entropy alloys, and so on. Major instruments covered include X-Ray Diffraction, NSOM Raman, X-Ray Photo Spectroscopy, UV-VIS- NIR Spectrosphotometer, Fourier Transfer Infrared Spectroscopy, Differential Scanning Calorimeter, Profilometer, and Thermogravimetric analysis.

Features:

  • Covers material characterization techniques and the development of advanced characterization technology
  • Includes multiple length scale characterization approaches for a large variety of materials, from nano- to micron-scale, as well as their constraints
  • Discusses advanced material characterization technology in the microstructural and property characterization fields
  • Reviews both practical and theoretical explanations of approaches for characterizing microstructure and properties
  • Offers fundamentals, basic instrumentation details, experimental approaches, analyses, and applications with case studies

This book is aimed at graduate students and researchers in materials science and engineering.

Table of Contents

1.Introduction 2. X-Ray Diffraction (XRD) 3. Nano-Mechanical System 4. X-Ray Photo-Spectroscopy (XPS) 5. Scanning Electron Microscope (SEM) 6. Field-Emission Scanning Electron Microscope (FESEM) 7. Transmission Electron Microscope (TEM) 8. Atomic Force Microscope (AFM) 9. Near Scanning Optical Microscope RAMAN 10. Optical Characterization Instruments 11. Synchrotron Techniques 12. Other Advanced Instruments Used For Characterization Of Functionally Graded Materials

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Author(s)

Biography

Ch Sateesh Kumar completed his PhD from National Institute of Technology, Rourkela. He worked as Visiting Assistant Professor in Thapar Institute of Engineering and Technology. Later he joined Advanced Materials Group at Czech Technical University, Prague as Postdoctoral Researcher. Presently he is employed as Assistant Professor in the Department of Mechanical Engineering, Madanapalle Institute of Technology & Science, Also, he is working as Senior Research Associate in the Department of Mechanical & Industrial Technology, University of Johannesburg, His research interests include machining, surface modification techniques, coating deposition and characterization, and tribology. He has published 21 research articles in highly reputed journals and also presented his work in 7 renowned conferences. He has also extended his services as a reviewer in many reputed journals.

M. Muralidhar Singh's research interests are in the area of development of multilayer coatings for solar thermal receiver tube, composite material and thin-films, I have published 16 SCI and 6 Scopus indexed international journals. I have worked on various techniques such as magnetron sputtering and plasma enhanced chemical vapour deposition technique will be used to deposit metallic and hybrid/composite coatings of metal/ dielectric on metal tubes and the optimization of magnetron sputtering and plasma enhanced chemical vapour deposition for coating thickness, multilayer stacking sequence and composition of material to obtain the best performance characteristics by characterizing the coatings for absorption, emittance and thermal properties, stability at high temperature for CSP applications and the software tools such as COMSOL Multi-physics, CODE, TSol and Essential Macleod, will be used to simulate and determine the absorption and emittance. Experimental results will be used to develop models for prediction of optimum coating thickness of individual layer and multilayers, evaluation the performance of multilayer coatings after thermal cycling. I have hands-on experience on deposition, characterization and testing of thin-film coating deposited by different methods like thermal evaporation, E-beam, DC, PDC magnetron sputtering and plasma-enhanced chemical vapor deposition (PECVD). The instruments used for characterization are UV-VIS-NIR spectrophotometer, FTIR, SEM, XRD, EDAX, Nano-mechanical system, computer interfaced differential scanning calorimeter, universal testing machine, fatigue, Impact testing machine.

Ram Krishna holds a PhD in Mechanics of Materials from the School of Engineering, University of Leicester, United Kingdom. His undergraduate and master’s degree is from NIT Jamshedpur and IIT Kanpur. Currently, he is an Associate Professor and Associate Dean of Industry Institute Interaction Cell at MITS. He is also holding an Adjunct Professorship at Nisantasi University, Istanbul. Prior to coming India in 2019, he worked as a Researcher in the niche area of material development for Generation IV Reactors, at the School of Mechanical, Aerospace and Civil Engineering, University of Manchester, United Kingdom and North Carolina State University, Raleigh, United States in association with Oak Ridge National Laboratory, USA. To date, he has 33 high-quality journal publications with an increasing Google Scholar h-index of 10. In India, he filed two patents on "design of a plasmatron" and "mass production of metal/ceramics nanopowders for use in Metallic and ceramic 3D Printing, which are under examination. He has won several synchrotron source proposals from Diamond Light Source, Oxford, UK, and SLAC National Accelerator Laboratory, Stanford, USA, in addition to the MeV (Modelling, Experimentation and Accreditation) awards. His research area includes understanding of the fundamental behaviour of 3D printed products from meso-to-micron length scales and implementation of AI/ML/Data Science/Block Chain/Cyber Security in developing digital manufacturing and securing mechanical systems.