Intelligent Integrated Systems: Devices, Technologies, and Architectures, 1st Edition (Hardback) book cover

Intelligent Integrated Systems

Devices, Technologies, and Architectures, 1st Edition

Edited by Simon Deleonibus

Jenny Stanford Publishing

516 pages | 23 Color Illus. | 233 B/W Illus.

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pub: 2014-04-09
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Description

This book gives a state-of-the-art overview by internationally recognized researchers of the architectures of breakthrough devices required for future intelligent integrated systems. The first section highlights Advanced Silicon-Based CMOS Technologies. New device and functional architectures are reviewed in chapters on Tunneling Field-Effect Transistors and 3-D monolithic Integration, which the alternative materials could possibly use in the future. The way we can augment silicon technologies is illustrated by the co-integration of new types of devices, such as molecular and resistive spintronics-based memories and smart sensors, using nanoscale features co-integrated with silicon CMOS or above it.

Reviews

"This book gives an outstanding summary of the current state of the art for the ultimate integrated nanoelectronic device technology. Simon has pulled together a great team of leading researchers who not only describe the present but are also looking ahead on possible and probable future technology directions. The reader can enjoy an up-to-date reference list on current research in the respective fields, including new device architectures and new multifunctional solutions. Definitely on the reading recommendations for my PhD students!"

—Prof. Mikael Östling, KTH Royal Institute of Technology, Sweden

"The appearance of this book is very timely, given its comprehensive coverage of major topics in advanced CMOS technologies, as well as futuristic ‘beyond Si’ technologies. The editor is a well-recognized world leader in the field, and the authors are first-class experts who are well qualified to write their respective chapters. This book will benefit numerous students/engineers/researchers, and I plan to use it as a textbook in my advanced graduate-level class on ‘Advanced CMOS Technologies.’"

—Prof. T. P. Ma, Yale University, USA

"Nowadays, there is such a diversity in the new device technologies that even professional researchers have difficulty to catch up on them all. The publication of the book Intelligent Integrated Systems: Devices, Technologies, and Architectures is very timely, because it gives state-of-the-art information about semiconductors to engineers and students."

—Prof. Hiroshi Iwai, Tokyo Institute of Technology, Japan

Table of Contents

Introduction

Intelligent Integrated Systems Forward to Zero Variability and Zero Power! S. Deleonibus

Advanced Silicon-Based CMOS Technologies

From Planar to Trigate and Nanowires Fully Depleted Transistors, Francois Andrieu, Olivier Weber, Marie-Anne Jaud, Thomas Ernst, and Olivier Faynot

Schottky Source/Drain MOSFETs, Emmanuel Dubois, Guilhem Larrieu, Nicolas Reckinger, Xiaohui Tang, Jean-Pierre Raskin, Maud Vinet, and Louis Hutin

Advances in Silicon-On-Diamond Technology, Jean-Paul Mazellier, Julie Widiez, Marc Rabarot, François Andrieu, Samuel Saada, Mathieu Lions, Philippe Bergonzo, and Simon Deleonibus

GeOI, SiGeOI and New Devices Architectures, Cyrille Le Royer, Emmanuel Augendre, Louis Hutin, Frédéric Mayer, William Van den Daele

3D Monolithic Integration, Maud Vinet, Perrine Batude, Shashikanth Bobba

III-V Quantum-Well FETs, Suman Datta

Carbon Integrated Electronics, Hong Li, Yasin Khatami, Deblina Sarkar, Jiahao Kang, Chuan Xu, Wei Liu, and Kaustav Banerjee

New Paths to Augmented Silicon CMOS Technologies

Tunneling Field-Effect Transistors – Challenges and Perspectives, Joachim Knoch

Molecular Memories, Julien Buckley, Tiziana Pro, Venera Aiello, Micaël Charbonneau, and Barbara De Salvo

Resistive Memories, Blanka Magyari-Köpe and Yoshio Nishi

High frequency vibrating nanowire, Laurent Duraffourg and Thomas Ernst

Spintronics, Guillaume Prenat, Ursula Ebels, Gregory Di Pendina, Ricardo Sousa, and Bernard Dieny

Smart Multiphysics Sensors, Masayoshi Esashi

3D Integration and Wafer Level Packaging, Gilles Poupon

About the Series

Pan Stanford Series on Intelligent Nanosystems

Learn more…

Subject Categories

BISAC Subject Codes/Headings:
TEC008000
TECHNOLOGY & ENGINEERING / Electronics / General
TEC021000
TECHNOLOGY & ENGINEERING / Material Science