1st Edition

Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing

Edited By

Tadahiro Ohmi

ISBN 9780849335433
Published December 21, 2005 by CRC Press
400 Pages 465 B/W Illustrations

USD $250.00

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Book Description

As science pushes closer toward the atomic size scale, new challenges arise to slow the pace of the miniaturization that has transformed our society and fueled the information age. New technologies are necessary to surpass these obstacles and realize the tremendous growth predicted by Moore's law. Assembled from the works of pioneering researchers, Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing presents new developments and technologies for producing the next generation of electronic circuits and displays.

This book introduces radical-reaction-based semiconductor manufacturing technologies that overcome the limitations of the existing molecule-reaction-based technologies. It systematically details the procedures and underlying concepts involved in wet process technologies and applications. Following an introduction to semiconductor surface chemical electronics, expert contributors discuss the principles and technology of high-performance wet cleaning; etching technologies and processes; antistatic technology; wet vapor resist stripping technology; and process and safety technologies including waste reclamation, chemical composition control, and ultrapure water and liquid chemical supply systems and materials for fluctuation-free facilities.

Currently, large production runs are needed to balance the costs of acquiring and tuning equipment for specialized operating conditions. Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing explains the technologies and processes used to meet the demand for variety and low volumes that exists in today's digital electronics marketplace.

Table of Contents

Surface Chemical Electronics at the Semiconductor Surface; Tadahiro Ohmi

Principles of Semiconductor Device Wet Cleaning; Hitoshi Morinaga

High-Performance Wet-Cleaning Technology; Hiroshi Morita, Akinobu Teramoto, Senri Ojima, and Kerichi Mitshumori

Etching of Various SiO2; Tatsuhiro Yabune, Masayuki Miyashita, Hirohisa Kikuyama, Jun Takano, and Akinobu Taramoto

Silicon Etching; Kenichi Mitsumori and Nobuhiko Inoue

Chemical Composition Control Technology; Tatsuhiro Yabune, Masayuki Miyashita, Hirohisa Kikuyama, and Jun Takano

Wet Vapor Resist Stripping Technology; Senri Ojima and Tadahiro Ohmi

Antistatic Technology; Kenichi Mitsumori and Takashi Imaoka

Chemical Waste Reclamation Technology; Hiroshi Sugawara and Takashi Imaoka

Ultrapure Water and Gas-Dissolved Water Supply System for Fluctuation-Free Facility; Ikunori Yokoi, Masaaki Nagase, Koji Nishino, Nobukazu Ikeda, Masafumi Kitano, Hiroto Izumi, and Tadahiro Ohmi

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